Name: Xiaomi Poco F6 5G 512GB ROM 12GB RAM Dual SIM GSM Unlocked - Titanium Xiaomi N/A
Brand: Xiaomi
SKU: 00694181278221
Price: 7000 MXN
Availability: OutOfStock

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<ul><li>Almacenamiento Amplio: Incluye 512 GB de ROM y 12 GB de RAM LPDDR5X + UFS 4.0 para mayor velocidad de lectura y escritura.</li><li>Procesamiento de Última Generación: Equipado con el procesador Qualcomm Snapdragon 8s Gen 3 de 4nm con arquitectura Prime Cortex-X4.</li><li>Visualización Fluida: Pantalla de 6.67" con tasa de refresco de 120Hz.</li><li>Fotografía Versátil: Cámara triple de 50 MP.</li><li>Experiencia de Juego Mejorada: Optimización WildBoost 3.0 y Super Resolution Rendering para gráficos más claros y rendimiento mejorado.</li></ul>

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Procesador con Generación

<ul><li><div data-csa-c-id="le0i8w-wqcx84-s8ioxl-gfxyga" data-cel-widget="title_feature_div" data-csa-c-is-in-initial-active-row="false" data-csa-c-asin="B0D5VM8S1K" data-csa-c-slot-id="title_feature_div" data-csa-c-content-id="title" data-csa-c-type="widget" data-feature-name="title" class="celwidget" id="title_feature_div">
<div class="a-section a-spacing-none" id="titleSection">
<h1 class="a-size-large a-spacing-none">Xiaomi Poco F6 5G + 4G LTE 512GB + 12GB Global Version Unlocked 6.67" 120Hz 50Mp Triple Camera (Tmobile Mint Tello &amp; Global) Titanium</h1>
POCO F6 is powered by the next-generation flagship Qualcomm processor, which adopts TSMC's 4nm process and same generation CPU architecture Prime Cortex-X4 core as Snapdragon® 8 Gen 3. It boasts top-tier CPU and powerful GPU performance, ensuring seamless mobile gaming experience. LPDDR5X + UFS 4.0 Flagship chipset The next-generation flagship high-speed chipset features higher read and write speeds for smoother multitasking performance. WildBoost Optimization 3.0 A pleasurable gaming experience Bring incredible gaming to hardcore POCOers. Powered by Xiaomi HyperOS and Snapdragon® 8s Gen 3, performance scheduling, image rendering and game control are all enhanced for a comprehensive experience upgrade. Super Resolution Rendering* Clearer gaming graphics Break through the original graphics quality, making the game characters more refined and the scene pictures more realistic. High-efficiency heat-dissipating graphite Enhanced with high-efficient graphite and upgraded manufacturing processes, thermal conductivity has been increased by 13%* compared to the previous generation.
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Xiaomi Poco F6 5G 512GB ROM 12GB RAM Dual SIM GSM Unlocked - Titanium Xiaomi N/A

Devolución hasta 30 días después de recibido.

<div data-csa-c-id="le0i8w-wqcx84-s8ioxl-gfxyga" data-cel-widget="title_feature_div" data-csa-c-is-in-initial-active-row="false" data-csa-c-asin="B0D5VM8S1K" data-csa-c-slot-id="title_feature_div" data-csa-c-content-id="title" data-csa-c-type="widget" data-feature-name="title" class="celwidget" id="title_feature_div">
<div class="a-section a-spacing-none" id="titleSection">
<h1 style="text-align: center;" class="a-size-large a-spacing-none">Xiaomi Poco F6 5G + 4G LTE 512GB + 12GB Global Version Unlocked 6.67" 120Hz 50Mp Triple Camera (Tmobile Mint Tello &amp; Global) Titanium</h1>
POCO F6 is powered by the next-generation flagship Qualcomm processor, which adopts TSMC's 4nm process and same generation CPU architecture Prime Cortex-X4 core as Snapdragon® 8 Gen 3. It boasts top-tier CPU and powerful GPU performance, ensuring seamless mobile gaming experience. LPDDR5X + UFS 4.0 Flagship chipset The next-generation flagship high-speed chipset features higher read and write speeds for smoother multitasking performance. WildBoost Optimization 3.0 A pleasurable gaming experience Bring incredible gaming to hardcore POCOers. Powered by Xiaomi HyperOS and Snapdragon® 8s Gen 3, performance scheduling, image rendering and game control are all enhanced for a comprehensive experience upgrade. Super Resolution Rendering* Clearer gaming graphics Break through the original graphics quality, making the game characters more refined and the scene pictures more realistic. High-efficiency heat-dissipating graphite Enhanced with high-efficient graphite and upgraded manufacturing processes, thermal conductivity has been increased by 13%* compared to the previous generation.
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