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Paquete De Hoja Bond Carta Xerox Marathon 500 Hojas 1 Resma Xerox 500 hojas

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SOLDADORA INVERSORA OAKLAND MIG 130I OAKLAND MIG 130I

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<div>¡El producto es muy bueno, ¡ creo que te gustará!</div>

<ul><li>1、PASTE COMPOSITION: The composition of the solder paste is Sn96.5, Ag3 and Cu0.5, with 20‑38um (No. 4 powder) particles. 2、HIGH MELTING POINT: High temperature soldering flux paste has a melting point of 217℃ for more maintenance situations. 3、NO NEED CLEAN: The high temperature solder paste does not require cleaning flux, easy to operate, with wide range of application. 4、MULTIPLE USAGES: Solder paste can be used for maintenance of mobile phones, hard disks, CPUs, ICs, etc., with strong practicability. 5、HIGH EFFICIENCY: Provides more controlled and accurate welding, increasing efficiency and speeding up the welding process.
Item Type: Solder Paste Model: SFD-226 Composition: Sn96.5, Ag3, Cu0.5 Granules: 20-38um (No. 4 powder) Applicable: Used to repair mobile phone, hard disk, CPU, IC, etc. Melting Point: 217℃
1 x Solder Paste</li></ul>

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No Clean Solder Paste High Temperature Soldering Flux Cream for Mobile Phone Repair SFD‑226

1、PASTE COMPOSITION: The composition of the solder paste is Sn96.5, Ag3 and Cu0.5, with 20‑38um (No. 4 powder) particles. 2、HIGH MELTING POINT: High temperature soldering flux paste has a melting point of 217℃ for more maintenance situations. 3、NO NEED CLEAN: The high temperature solder paste does not require cleaning flux, easy to operate, with wide range of application. 4、MULTIPLE USAGES: Solder paste can be used for maintenance of mobile phones, hard disks, CPUs, ICs, etc., with strong practicability. 5、HIGH EFFICIENCY: Provides more controlled and accurate welding, increasing efficiency and speeding up the welding process.
Item Type: Solder Paste Model: SFD-226 Composition: Sn96.5, Ag3, Cu0.5 Granules: 20-38um (No. 4 powder) Applicable: Used to repair mobile phone, hard disk, CPU, IC, etc. Melting Point: 217℃
1 x Solder Paste