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<div>Welcome to our store! We hope you have a wonderful shopping experience!</div>

<ul><li>Features: brand new and high quality 
After-sales Service:We committed to provide superior thermal pads, easy to install, feel free to contact us if there is any issue with our thermal pads. 
Easy to Install:Dimension 85x45mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces for gap. 
Excellent Thermal Conductivity:Upgraded thermal silica gel material with 12.8 for W/for m k thermal conductivity, thermal pad greatly improve the heat transfer between the electronic elements. 
Plasticity:Good elasticity and compression properties, contact with any electrical traces wouldn’for t result in damage of any sort. 
Widely Application:One pad is multi-purpose, insulated and non-conductive, it is safe in use, used for graphics card memory North and South Bridge, RDRAM memory module, communication equipment, SSD solid state hard drive, game console equipment, car control device. 
Specifications: Product Name:Thermal Pad 
Thickness:0.5/1.0/1.5/2.0/3.0mm(optional) 
Thermal pad:12.8w/for m k 
Color:grey 
Density:3.1±0.2g/cc 
Hardness:30~50s 
Product Size: approx. 85x45mm/3.35x1.77in 
Package Includes: 1 x Thermal Pad 
note: No retail package. 
Due to the problems of lighting effects and shooting angles, there will be certain tolerances in the product, please understand. 
Please allow 0-1cm error due to the manual measurment.</li></ul>

Condición

Material

País de Origen

Ancho del Producto Ensamblado

Gama Color

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Altura del Producto Ensamblado

Marca

Thermal Pad 12.8 for W/for m K Non Conductive Heat Resistance High Temperature Resistance Dissipation Silicone Thermal P

Features: brand new and high quality 
After-sales Service:We committed to provide superior thermal pads, easy to install, feel free to contact us if there is any issue with our thermal pads. 
Easy to Install:Dimension 85x45mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces for gap. 
Excellent Thermal Conductivity:Upgraded thermal silica gel material with 12.8 for W/for m k thermal conductivity, thermal pad greatly improve the heat transfer between the electronic elements. 
Plasticity:Good elasticity and compression properties, contact with any electrical traces wouldn’for t result in damage of any sort. 
Widely Application:One pad is multi-purpose, insulated and non-conductive, it is safe in use, used for graphics card memory North and South Bridge, RDRAM memory module, communication equipment, SSD solid state hard drive, game console equipment, car control device. 
Specifications: Product Name:Thermal Pad 
Thickness:0.5/1.0/1.5/2.0/3.0mm(optional) 
Thermal pad:12.8w/for m k 
Color:grey 
Density:3.1±0.2g/cc 
Hardness:30~50s 
Product Size: approx. 85x45mm/3.35x1.77in 
Package Includes: 1 x Thermal Pad 
note: No retail package. 
Due to the problems of lighting effects and shooting angles, there will be certain tolerances in the product, please understand. 
Please allow 0-1cm error due to the manual measurment.